Kinetic analysis of the thermal degradation of printed wiring boards

Alex Luyima; Lifeng Zhang; Lucas Nana Wiredu Damoah

doi:10.1007/s11837-011-0134-y

Kinetic analysis of the thermal degradation of printed wiring boards

Alex Luyima, Lifeng Zhang, Lucas Nana Wiredu Damoah

Missouri University of Science and Technology

Research output: Contribution to journal › Article › peer-review

6 Citations (Scopus)

Abstract

The non-isothermal pyrolysis of printed wiring boards (PWBs) was investigated by simultaneous thermogravimetric and differential thermal analysis (TG-DTA) in the temperature range of 300-1200 K. Pyrolysis experiments were carried out on PWBs samples at three different heating rates of 10, 20, and 30°C/min. In this study, the kinetic parameters of PWBs pyrolysis have been estimated using model free and model fitted methods.

Original language	English
Pages (from-to)	33-37
Number of pages	5
Journal	JOM
Volume	63
Issue number	8
DOIs	https://doi.org/10.1007/s11837-011-0134-y
Publication status	Published - Aug 2011
Externally published	Yes

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10.1007/s11837-011-0134-y

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Kinetic analysis of the thermal degradation of printed wiring boards

Abstract

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