Effect of thermal annealing on transparent conductive LaNiO₃ thin film prepared by an aqueous method

Dense, crack-free and uniform lanthanum nickel oxide (LNO) thin films were prepared by an aqueous method on various substrates, such as single crystal silicon, microcrystalline glass ceramic (GC) and amorphous glass. The effects of various thermal annealing temperatures on the microstructure, interface and electrical properties of the LNO films were investigated by XRD and SEM with the EDX and a four-probe method, respectively. It was found that with the increase in thermal annealing temperature, the LNO film on Si substrates displayed a structure change from pseudocubic to rhombohedral and was accompanied by the appearance of a NiO impure phase, while the LNO film on a GC substrate diffused into the substrate. In these cases, the film resistivity was increased. As a result, a LNO thin film with a resistivity of 2-3×10^-5 Ω·m was achieved by thermally annealing at 750-800 °C for 1 hour in air. The measurement of the surface resistance under different temperatures shows that the LNO film possesses better high temperature stability. Its transmittance spectrum was also observed.