Controlling the resistivity of multi-walled carbon nanotube networks by copper encapsulation

Yong Sun, Boateng Onwona-Agyeman, Tatsuro Miyasato

Research output: Contribution to journalArticlepeer-review

8 Citations (Scopus)

Abstract

The resistivity of multi-walled carbon nanotube networks can be changed by filling Cu into the nanotubes as well as by preparing the nanotube networks with various densities. The resistivity can be controlled to be lower than the c-axis resistivity of graphite, and has a low temperature coefficient of -1.12 × 10-5/K over the temperature range of 20-500 K. Filling Cu into the nanotubes decreases the intra-tube resistivity, but the temperature coefficient of the resistivity is governed by the inter-tube resistivity of the nanotube network.

Original languageEnglish
Pages (from-to)3187-3190
Number of pages4
JournalMaterials Letters
Volume65
Issue number19-20
DOIs
Publication statusPublished - Oct 2011
Externally publishedYes

Keywords

  • Copper encapsulation
  • Electrical resistivity
  • Multi-walled carbon nanotube network
  • Temperature coefficient

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