Abstract
The resistivity of multi-walled carbon nanotube networks can be changed by filling Cu into the nanotubes as well as by preparing the nanotube networks with various densities. The resistivity can be controlled to be lower than the c-axis resistivity of graphite, and has a low temperature coefficient of -1.12 × 10-5/K over the temperature range of 20-500 K. Filling Cu into the nanotubes decreases the intra-tube resistivity, but the temperature coefficient of the resistivity is governed by the inter-tube resistivity of the nanotube network.
Original language | English |
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Pages (from-to) | 3187-3190 |
Number of pages | 4 |
Journal | Materials Letters |
Volume | 65 |
Issue number | 19-20 |
DOIs | |
Publication status | Published - Oct 2011 |
Externally published | Yes |
Keywords
- Copper encapsulation
- Electrical resistivity
- Multi-walled carbon nanotube network
- Temperature coefficient