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0.86-nm CET gate stacks with epitaxial Gd2O3 high-κ dielectrics and FUSI NiSi metal electrodes

  • H. D.B. Gottlob
  • , T. Echtermeyer
  • , M. Schmidt
  • , T. Mollenhauer
  • , J. K. Efavi
  • , T. Wahlbrink
  • , M. C. Lemme
  • , M. Czernohorsky
  • , E. Bugiel
  • , A. Fissel
  • , H. J. Osten
  • , H. Kurz
  • AMO GmbH
  • Leibniz University of Hannover

Research output: Contribution to journalArticlepeer-review

50 Citations (Scopus)

Abstract

In this letter, ultrathin gadolinium oxide (Gd2O3) high-κ gate dielectrics with complementary-metal-oxide- semiconductor (CMOS)-compatible fully silicided nickel-silicide metal gate electrodes are reported for the first time. MOS capacitors with a Gd2O3 thickness of 3.1 nm yield a capacitance equivalent oxide thickness of CET = 0.86 nm. The extracted dielectric constant is κ = 13-14. Leakage currents and equivalent oxide thicknesses of this novel gate stack meet the International Technology Roadmap for Semiconductors targets for the near term schedule and beyond.

Original languageEnglish
Pages (from-to)814-816
Number of pages3
JournalIEEE Electron Device Letters
Volume27
Issue number10
DOIs
Publication statusPublished - 2006
Externally publishedYes

Keywords

  • Epitaxial dielectric
  • Fully silicided (FUSI)
  • GdO
  • High-k
  • Metal gate
  • NiSi
  • Rare earth oxide

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