0.86-nm CET gate stacks with epitaxial Gd2O3 high-κ dielectrics and FUSI NiSi metal electrodes

H. D.B. Gottlob, T. Echtermeyer, M. Schmidt, T. Mollenhauer, J. K. Efavi, T. Wahlbrink, M. C. Lemme, M. Czernohorsky, E. Bugiel, A. Fissel, H. J. Osten, H. Kurz

Research output: Contribution to journalArticlepeer-review

50 Citations (Scopus)

Abstract

In this letter, ultrathin gadolinium oxide (Gd2O3) high-κ gate dielectrics with complementary-metal-oxide- semiconductor (CMOS)-compatible fully silicided nickel-silicide metal gate electrodes are reported for the first time. MOS capacitors with a Gd2O3 thickness of 3.1 nm yield a capacitance equivalent oxide thickness of CET = 0.86 nm. The extracted dielectric constant is κ = 13-14. Leakage currents and equivalent oxide thicknesses of this novel gate stack meet the International Technology Roadmap for Semiconductors targets for the near term schedule and beyond.

Original languageEnglish
Pages (from-to)814-816
Number of pages3
JournalIEEE Electron Device Letters
Volume27
Issue number10
DOIs
Publication statusPublished - 2006
Externally publishedYes

Keywords

  • Epitaxial dielectric
  • Fully silicided (FUSI)
  • GdO
  • High-k
  • Metal gate
  • NiSi
  • Rare earth oxide

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